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Emission Factor

Printed wiring board - for through-hole mounting - Pb containing surface (printed wiring board production)

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Emission factor summary

The activity generating the emissions is printed wiring board production, for through-hole mounting, Pb containing surface. The reference product is printed wiring board, for through-hole mounting, Pb containing surface. This product represents 1 m2 of an unmounted printed wiring board for through-hole mounting devices. The product is based on a 1.6mm 2-layer FR-4 printed wiring board with a square weight of 3.08 kg. The surface used for mounting the components is lead containing. The reference product amount is 1. The cut-off classification is allocatable product. The activity type is ordinary ordinary transforming activity. Please refer to the ecoinvent documentation here for full details: https://ecoquery.ecoinvent.org/3.11/cutoff/dataset/7111/documentation.

PropertyValue
NamePrinted wiring board - for through-hole mounting - Pb containing surface (printed wiring board production)
SectorEquipment
CategoryElectronics
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.11
Region
Global (GLOBAL)
Unit Type
Area
Year
2003
Year Released
2024
Emission Factor
  • CO2e
    kg/m2
Scopes3.1, 3.2
LCA Activity
unknown
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Replaced
  • Replaced in: 29Version log
  • Replaced by: e11ad2c7-7aa9-49a6-94cf-5d5ea6f724be

API Reference

Activity ID
electronics-type_printed_wiring_board_for_through_hole_mounting_pb_containing_surface_printed_wiring_board_production_for_through_hole_mounting_pb_containing_surface
UUID
600df65d-e8e6-4c55-9ae3-3a7a8d1dc68b
Code Snippet
View API Docs

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