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Emission Factor

Printed wiring board - for through-hole mounting - Pb containing surface (printed wiring board production)

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Emission factor summary

The activity generating the emissions is printed wiring board production, for through-hole mounting, Pb containing surface. The Reference Product is printed wiring board, for through-hole mounting, Pb containing surface. This product represents 1 m2 of an unmounted printed wiring board for through-hole mounting devices. The product is based on a 1.6mm 2-layer FR-4 printed wiring board with a square weight of 3.08 kg. The surface used for mounting the components is lead containing. The Reference Product amount is 1. The cut-off classification is allocatable product. The activity type is ordinary transforming activity. Please refer to the ecoinvent documentation for full details: https://ecoquery.ecoinvent.org/3.12/cutoff/dataset/7111/documentation

PropertyValue
NamePrinted wiring board - for through-hole mounting - Pb containing surface (printed wiring board production)
SectorEquipment
CategoryElectronics
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.12
Region
Global (GLOBAL)
Unit Type
Area
Year
2003
Year Released
2025
Emission Factor
  • CO2e
    kg/m2
Scopes3.1, 3.2
LCA Activity
source_specific
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Current

API Reference

Activity ID
electronics-type_printed_wiring_board_for_through_hole_mounting_pb_containing_surface_printed_wiring_board_production_for_through_hole_mounting_pb_containing_surface
UUID
e11ad2c7-7aa9-49a6-94cf-5d5ea6f724be
Code Snippet
View API Docs

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