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Emission Factor

Printed wiring board - for through-hole mounting - pb containing surface (printed wiring board production - for through-hole mounting - Pb containing surface)

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Emission factor summary

Emissions generated by the activity within the product supply chain as described in ecoinvent v3.10. This product represents 1 m2 of an unmounted printed wiring board for through-hole mounting devices. The product is based on a 1.6mm 2-layer FR-4 printed wiring board with a square weight of 3.08 kg. The surface used for mounting the components is lead containing. The cut-off classification is allocatable product. The activity type is ordinary transforming activity. The reference product amount is 1.

PropertyValue
NamePrinted wiring board - for through-hole mounting - pb containing surface (printed wiring board production - for through-hole mounting - Pb containing surface)
SectorEquipment
CategoryElectronics
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.10
Region
Global (GLOBAL)
Unit Type
Area
Year
2003
Year Released
2023
Emission Factor
  • CO2e0000kg/m2
LCA Activity
unknown
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Current

API Reference

Activity ID
electronics-type_printed_wiring_board_for_through_hole_mounting_pb_containing_surface_printed_wiring_board_production_for_through_hole_mounting_pb_containing_surface
UUID
470fe9af-49a2-4ee1-a92d-3e05aae0ef6f
Code Snippet
View API Docs

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