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Emission Factor

Mounting - through-hole technology - Pb-containing solder

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Emission factor summary

The activity generating the emissions is mounting, through-hole technology, Pb-containing solder. The reference product is mounting, through-hole technology, Pb-containing solder. This is a service, representing the mounting of 1 m2 of printed wiring board by soldering through-hole components to the board. Lead-containing solder paste (Sn63Pb67) is used. The reference product amount is 1. The cut-off classification is allocatable product. The activity type is ordinary ordinary transforming activity. Please refer to the ecoinvent documentation here for full details: https://ecoquery.ecoinvent.org/3.11/cutoff/dataset/3590/documentation.

PropertyValue
NameMounting - through-hole technology - Pb-containing solder
SectorEquipment
CategoryElectronics
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.11
Region
Global (GLOBAL)
Unit Type
Area
Year
2005
Year Released
2024
Emission Factor
  • CO2e0000kg/m2
LCA Activity
unknown
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Current

API Reference

Activity ID
electronics-type_mounting_through_hole_technology_pb_containing_solder_mounting_through_hole_technology_pb_containing_solder
UUID
44e90065-cdab-4b60-887d-72b1e62d1f6c
Code Snippet
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