climatiq.io
Explorer
Try Autopilot, our emission factor recommendation engine →
Emission Factor

Mounting - through-hole technology - Pb-containing solder

Interested in licensing this data?

Request a quote

Emission factor summary

The activity generating the emissions is mounting, through-hole technology, Pb-containing solder. The Reference Product is mounting, through-hole technology, Pb-containing solder. This is a service, representing the mounting of 1 m2 of printed wiring board by soldering through-hole components to the board. Lead-containing solder paste (Sn63Pb67) is used. The Reference Product amount is 1. The cut-off classification is allocatable product. The activity type is ordinary transforming activity. Please refer to the ecoinvent documentation for full details: https://ecoquery.ecoinvent.org/3.12/cutoff/dataset/3590/documentation

PropertyValue
NameMounting - through-hole technology - Pb-containing solder
SectorEquipment
CategoryElectronics
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.12
Region
Global (GLOBAL)
Unit Type
Area
Year
2005
Year Released
2025
Emission Factor
  • CO2e
    kg/m2
Scopes3.1, 3.2
LCA Activity
source_specific
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Current

API Reference

Activity ID
electronics-type_mounting_through_hole_technology_pb_containing_solder_mounting_through_hole_technology_pb_containing_solder
UUID
71cdfb3f-9e21-4e93-a1b7-d452eda29482
Code Snippet
View API Docs

Automate emission calculations with Climatiq

Calculate API→Upload a CSV→Microsoft Excel Add-in→Google Sheets App→

Related factors

ecoinvent Emission Factors

Explore All

Electronics Emission Factors

Explore All