Global

Multilayer printed circuit board (ENIG)

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Emission intensity of the raw material supply stage for an average multilayer ENIG printed circuit board, per m2. The stage covers laminate, galvanisation, and other raw materials, as well as packaging and transport of raw materials and product packaging. According to Precoplat, the underlying data are sourced from the 2018 study "Environmental Carbon Footprints: Industrial Case Studies" (ISBN: 978-0-12-812849-7). This value forms part of the cradle-to-gate PCF calculated in accordance with ISO/TS 14067:2013 and published by Precoplat Präzisions-Leiterplatten-Technik GmbH in its Product Carbon Footprint factsheet, version 2.1. Data quality flag: Methodology - The source does not specify the IPCC AR version of GWPs used to calculate CO2e.

Product Carbon Footprint (PCF) of an average multilayer ENIG printed circuit board, per m2. The boundary is cradle-to-gate, covering raw material supply (laminate, galvanization, and other raw materials), manufacturing (energy, production, water, consumables, and waste), and associated packaging and transport of inputs. Transport to the end customer is excluded. The PCF was calculated in accordance with ISO/TS 14067:2013 and published by Precoplat Präzisions-Leiterplatten-Technik GmbH in its PCF factsheet, version 2.1. The underlying data is sourced from the study "Environmental Carbon Footprints: Industrial Case Studies" from 2018 (ISBN: 978-0-12-812849-7). Data quality flag: Methodology - The source does not specify the IPCC AR version of GWPs used to calculate CO2e. Also this is self-reported data from Precoplat.

Emission intensity of the manufacturing stage for an average multilayer ENIG printed circuit board, per m2. The stage covers energy use and production processes. According to Precoplat, the underlying data are sourced from the 2018 study "Environmental Carbon Footprints: Industrial Case Studies" (ISBN: 978-0-12-812849-7). This value forms part of the cradle-to-gate PCF calculated in accordance with ISO/TS 14067:2013 and published by Precoplat Präzisions-Leiterplatten-Technik GmbH in its Product Carbon Footprint factsheet, version 2.1. Data quality flag: Methodology - The source does not specify the IPCC AR version of GWPs used to calculate CO2e.

Emission intensity of printed circuit board - simple TV motherboard - gate to gate process. Retrieved from the file Base Carbone v23.9 published by ADEME. This emission factor contains the following biogenic gases: 13.192775kg CO2. For detailed guidance on the application and interpretation of these emission factors please refer to the documentation provided by the source.

Printed circuit board - simple TV motherboard

Emission intensity of printed circuit board - electric power supply - gate to gate process. Retrieved from the file Base Carbone v23.9 published by ADEME. This emission factor contains the following biogenic gases: 10.2128575kg CO2. For detailed guidance on the application and interpretation of these emission factors please refer to the documentation provided by the source.

Printed circuit board - electric power supply

Emission intensity of printed circuit board - LCD controllers and connected TV motherboard - gate to gate process. Retrieved from the file Base Carbone v23.9 published by ADEME. This emission factor contains the following biogenic gases: 20.13419188kg CO2. For detailed guidance on the application and interpretation of these emission factors please refer to the documentation provided by the source.

Printed circuit board - LCD controllers and connected TV motherboard

Property	Value
Name	Multilayer printed circuit board (ENIG)
Sector	Equipment
Category	Electronics
Source	Precoplat
Region	Global (GLOBAL)
Year	2018
LCA Activity	cradle_to_gate, manufacturing, raw_material_supply

Multilayer printed circuit board (ENIG)

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Electronics Emission Factors

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Audio and video equipment manufacturing

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Multilayer printed circuit board (ENIG)

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Electronics Emission Factors

Other communications equipment manufacturing

Audio and video equipment manufacturing

Computer storage device manufacturing

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