Multilayer printed circuit board (ENIG)

Product Carbon Footprint (PCF) of an average multilayer ENIG printed circuit board, per m2. The boundary is cradle-to-gate, covering raw material supply (laminate, galvanization, and other raw materials), manufacturing (energy, production, water, consumables, and waste), and associated packaging and transport of inputs. Transport to the end customer is excluded. The PCF was calculated in accordance with ISO/TS 14067:2013 and published by Precoplat Präzisions-Leiterplatten-Technik GmbH in its PCF factsheet, version 2.1. The underlying data is sourced from the study "Environmental Carbon Footprints: Industrial Case Studies" from 2018 (ISBN: 978-0-12-812849-7). Data quality flag: Methodology - The source does not specify the IPCC AR version of GWPs used to calculate CO2e. Also this is self-reported data from Precoplat.