Multilayer printed circuit board (ENIG)

Emission intensity of the raw material supply stage for an average multilayer ENIG printed circuit board, per m2. The stage covers laminate, galvanisation, and other raw materials, as well as packaging and transport of raw materials and product packaging. According to Precoplat, the underlying data are sourced from the 2018 study "Environmental Carbon Footprints: Industrial Case Studies" (ISBN: 978-0-12-812849-7). This value forms part of the cradle-to-gate PCF calculated in accordance with ISO/TS 14067:2013 and published by Precoplat Präzisions-Leiterplatten-Technik GmbH in its Product Carbon Footprint factsheet, version 2.1. Data quality flag: Methodology - The source does not specify the IPCC AR version of GWPs used to calculate CO2e.