Precoplat
About Precoplat
Precoplat Präzisions-Leiterplatten-Technik GmbH is a German printed circuit board (PCB) manufacturer that publishes a Product Carbon Footprint (PCF) factsheet for an average multilayer ENIG PCB. The underlying data come from the study "Carbon footprint analysis of printed circuit board" (Yung et al.) in Environmental Carbon Footprints: Industrial Case Studies (Elsevier, 2018).
Visit Precoplat websiteProduct Carbon Footprint v2.1
| Property | Value |
|---|---|
| Description | Precoplat Präzisions-Leiterplatten-Technik GmbH is a German printed circuit board (PCB) manufacturer that publishes a Product Carbon Footprint (PCF) factsheet for an average multilayer ENIG PCB. The underlying data come from the study "Carbon footprint analysis of printed circuit board" (Yung et al.) in Environmental Carbon Footprints: Industrial Case Studies (Elsevier, 2018). |
| Source type | Corporate |
| Original dataset URL | URL |
| Year released | 2025 |
| Geography | Global |
| Sector | |
| Type of data | Activity-based |
| Emission results | CO2e |
| Data Transformation | NA |
License
| Property | Value |
|---|---|
| Type of license | Publicly available |
| License URL | Not specified |
Data quality
| Property | Value |
|---|---|
| Data quality assurance | Vetted by Climatiq. For further information on data quality assurance, see: https://www.climatiq.io/methodology#Data-Quality |
| Quality flag(s) | Methodology The source does not clarify the IPCC AR version of GWPs used to calculate CO2e. This emission factor is self-reported by Precoplat. |
Methodology
| Property | Value |
|---|---|
| Standard | ISO/TS 14067:2013 |
| IPCC AR method |
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| LCA boundary |
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| Scope applicability |
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| Emissions breakdown |
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| Methodology description | Precoplat's Product Carbon Footprint (PCF) factsheet (version 2.1) reports the cradle-to-gate carbon footprint of an average multilayer ENIG (Electroless Nickel Immersion Gold) printed circuit board, expressed per m² of board. The PCF was calculated in accordance with ISO/TS 14067:2013. The system boundary covers: Raw material supply (raw_material_supply): laminate (FR4), galvanisation and other raw materials, plus packaging and transport of raw materials and product packaging Manufacturing (manufacturing): energy, production processes, water, consumables and waste Total cradle-to-gate (cradle_to_gate): the sum of the above stages Transport to the end customer is excluded. In addition to the stage-level values, the FR4 laminate and galvanisation inputs are provided as separate emission factors, as components of the raw material supply stage. According to Precoplat, the underlying data are sourced from the 2018 study "Environmental Carbon Footprints: Industrial Case Studies" (ISBN: 978-0-12-812849-7). |
| Limitation / key issues to note | The data is self-reported by Precoplat and represents an average multilayer ENIG PCB, not a specific board design (layer count, thickness or size). The underlying data dates from a 2018 study, so it may not reflect current production processes or energy mixes. |
Explore the Precoplat dataset
Featured Emission Factors in Precoplat
Explore All- Go to Multilayer printed circuit board (ENIG)
Multilayer printed circuit board (ENIG)
Equipment Equipment - Go to Galvanisation - printed circuit board
Galvanisation - printed circuit board
Materials and Manufacturing Materials and Manufacturing - Go to Laminate (FR4) - printed circuit board
Laminate (FR4) - printed circuit board
Materials and Manufacturing Materials and Manufacturing
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