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Emission Factor

Multilayer printed circuit board (ENIG)

160.51
kgCO2e/m2

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Emission factor summary

Emission intensity of the manufacturing stage for an average multilayer ENIG printed circuit board, per m2. The stage covers energy use and production processes. According to Precoplat, the underlying data are sourced from the 2018 study "Environmental Carbon Footprints: Industrial Case Studies" (ISBN: 978-0-12-812849-7). This value forms part of the cradle-to-gate PCF calculated in accordance with ISO/TS 14067:2013 and published by Precoplat Präzisions-Leiterplatten-Technik GmbH in its Product Carbon Footprint factsheet, version 2.1. Data quality flag: Methodology - The source does not specify the IPCC AR version of GWPs used to calculate CO2e.

PropertyValue
NameMultilayer printed circuit board (ENIG)
SectorEquipment
CategoryElectronics
SourcePrecoplat
Source DatasetProduct Carbon Footprint v2.1
Region
Global (GLOBAL)
Year
2018
Year Released
2025
Emission Factor
  • Total CO2e160.51kg/m2
Scopes
XX,XX
LCA Activity
manufacturing
Supported CO2e Calculation Method
xxx
Data Versioning
  • Status: Current

Detailed Metadata

UUID
xxxxxx-xxxx-xxxxxxxx-xxxx-xxxxxxxx
Unit Type
Unit Type

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