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Emission Factor

Mounting - surface mount technology - Pb-free solder (market for)

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Emission factor summary

The activity generating the emissions is market for mounting, surface mount technology, Pb-free solder. The reference product is mounting, surface mount technology, Pb-free solder. This is a service, representing the mounting of 1 m2 of printed wiring board by soldering surface mount components to the board. Lead-free solder paste (Sn95.5AG3.9CU0.6) is used. The reference product amount is 1. The cut-off classification is allocatable product. The activity type is ordinary market activity. Please refer to the ecoinvent documentation here for full details: https://ecoquery.ecoinvent.org/3.11/cutoff/dataset/1975/documentation.

PropertyValue
NameMounting - surface mount technology - Pb-free solder (market for)
SectorEquipment
CategoryElectronics
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.11
Region
Global (GLOBAL)
Unit Type
Area
Year
2011
Year Released
2024
Emission Factor
  • CO2e0000kg/m2
LCA Activity
unknown
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Current

API Reference

Activity ID
electronics-type_mounting_surface_mount_technology_pb_free_solder_market_for_mounting_surface_mount_technology_pb_free_solder
UUID
8e132d87-3dc9-429a-9da1-c3db8ea906b1
Code Snippet
View API Docs

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