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Emission Factor

Mounting - through-hole technology - Pb-free solder (market for)

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Emission factor summary

The activity generating the emissions is market for mounting, through-hole technology, Pb-free solder. The Reference Product is mounting, through-hole technology, Pb-free solder. This is a service, representing the mounting of 1 m2 of printed wiring board by soldering through-hole components to the board. Lead-free solder paste (Sn95.5AG3.9CU0.6) is used. The Reference Product amount is 1. The cut-off classification is allocatable product. The activity type is market activity. Please refer to the ecoinvent documentation for full details: https://ecoquery.ecoinvent.org/3.12/cutoff/dataset/4355/documentation

PropertyValue
NameMounting - through-hole technology - Pb-free solder (market for)
SectorEquipment
CategoryElectronics
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.12
Region
Global (GLOBAL)
Unit Type
Area
Year
2011
Year Released
2025
Emission Factor
  • CO2e
    kg/m2
Scopes3.1, 3.2
LCA Activity
cradle_to_consumer
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Current

API Reference

Activity ID
electronics-type_mounting_through_hole_technology_pb_free_solder_market_for_mounting_through_hole_technology_pb_free_solder
UUID
282493ea-afa9-4317-aa6d-600d44fad385
Code Snippet
View API Docs

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