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Emission Factor

Mounting - through-hole technology - pb-free solder (market for mounting - through-hole technology - Pb-free solder)

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Emission factor summary

Emissions generated by the activity within the product supply chain as described in ecoinvent v3.10. This is a service representing the mounting of 1 m2 of printed wiring board by soldering through-hole components to the board. Lead-free solder paste (Sn95.5AG3.9CU0.6) is used. The cut-off classification is allocatable product. The activity type is market activity. The reference product amount is 1.

PropertyValue
NameMounting - through-hole technology - pb-free solder (market for mounting - through-hole technology - Pb-free solder)
SectorEquipment
CategoryElectronics
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.10
Region
Global (GLOBAL)
Unit Type
Area
Year
2011
Year Released
2023
Emission Factor
  • CO2e
    kg/m2
LCA Activity
Refer to source
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Replaced
  • Replaced in: 20Version log
  • Replaced by: bdad77ba-a69c-4912-b3e8-29e310fc25f8

API Reference

Activity ID
electronics-type_mounting_through_hole_technology_pb_free_solder_market_for_mounting_through_hole_technology_pb_free_solder
UUID
b331d11d-b709-40ec-bb41-33bd3876cab2
Code Snippet
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