Printed wiring board mounting facility - through-hole mounting line (market for)

The activity generating the emissions is market for printed wiring board mounting facility, through-hole mounting line. The reference product is printed wiring board mounting facility, through-hole mounting line. This is an immobile infrastructure, representing the construction of a printed wiring board mounting facility, through-hole mounting line. The facility is an example of a THT mounting line, with a manual insertion of the components, followed by a wave solder machine. The total mass of the system is 1,600kg. The process includes material, production efforts (material treatment processes) and infrastructure for the production of all the machineries used. The reference product amount is 1. The cut-off classification is allocatable product. The activity type is ordinary market activity. Please refer to the ecoinvent documentation here for full details: https://ecoquery.ecoinvent.org/3.11/cutoff/dataset/8895/documentation.