Printed wiring board mounting facility - through-hole mounting line (market for printed wiring board mounting facility - through-hole mounting line)

Emissions generated by the activity within the product supply chain as described in ecoinvent v3.10. This is an immobile infrastructure representing the construction of a printed wiring board mounting facility through-hole mounting line. The facility is an example of a THT mounting line with a manual insertion of the components followed by a wave solder machine. The total mass of the system is 1 600kg. The process includes material production efforts (material treatment processes) and infrastructure for the production of all the machineries used. The cut-off classification is allocatable product. The activity type is market activity. The reference product amount is 1.