Emission Factor

Printed wiring board mounting facility - surface mounting line (printed wiring board mounting facility construction)

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Emission factor summary

The activity generating the emissions is printed wiring board mounting facility construction, surface mounting line. The reference product is printed wiring board mounting facility, surface mounting line. This is an immobile infrastructure, representing the construction of a printed wiring board mounting facility, surface mounting line. The facility is an example of a SMT mounting line that includes 3 small component placing machines, 2 big components placing machines, 1 inspection device and 1 reflow oven with a total mass of 19,300 kg. The process includes material, production efforts (material treatment processes) and infrastructure for the production of all the machineries used. The reference product amount is 1. The cut-off classification is allocatable product. The activity type is ordinary ordinary transforming activity. Please refer to the ecoinvent documentation here for full details: https://ecoquery.ecoinvent.org/3.11/cutoff/dataset/4193/documentation.

PropertyValue
NamePrinted wiring board mounting facility - surface mounting line (printed wiring board mounting facility construction)
SectorBuildings and Infrastructure
CategoryConstruction
Sourceecoinvent
Source DatasetCut-off Cumulative LCIA v3.11
Region
Unit Type
Year
2005
Year Released
2024
Emission Factor
  • CO2e0000kg/number
LCA Activity
unknown
Supported CO2e Calculation Method
AR5, AR6
Data Versioning
  • Status: Current

API Reference

Activity ID
construction-type_printed_wiring_board_mounting_facility_surface_mounting_line_printed_wiring_board_mounting_facility_construction_surface_mounting_line
UUID
4fa41d11-9287-48f5-8845-e67555927d1a
Code Snippet
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