Spent sawing slurry from Si-wafer cutting (treatment of)

The activity generating the emissions is treatment of spent sawing slurry from Si-wafer cutting. The Reference Product is spent sawing slurry from Si-wafer cutting. Spent sawing slurry from Si-wafer cutting is a solid waste under the category of industrial wastes. It is primarily generated in treatment process of sawing slurry. spent sawing slurry from Si-wafer cutting contain the following fractions: two fractions of silicon carbide and triethylene glycol in equal contributions. By the database default (and per unit of reference product),spent sawing slurry from Si-wafer cutting has 13.7184115523466% water on wet mass basis (86.2815884476534% dry matter) and Carbon present is of only fossil origin (32.36% on a dry matter basis). It has a lower heating value of 8.12 MJ/kg . This kind of by-product (recyclable or waste) can be generated from ordinary transforming activities, and as such can be considered for modelling waste outputs of comparable composition. In the ecoinvent database, this by-product is used in the following processes: treatment of spent sawing slurry from Si-wafer cutting. Based on the aforementioned treatments, this by-product receives, it is a non-hazardous waste. This by-product can be modelled on two levels: treatment activity and market activity. The former one refers to the specific technology treating the by-product while the latter level represents a mix of treatments. Users are encouraged to inspect the modelling assumptions of the treatment activities and when selecting the market to additionally inspect the treatment mix. Collection and transportation of this by-product is accounted in the respective market activity, users are advised to inspect and modify the average transportation distances for a case specific modelling. The Reference Product amount is -1. The cut-off classification is Waste. The activity type is ordinary transforming activity. Please refer to the ecoinvent documentation for full details: https://ecoquery.ecoinvent.org/3.12/cutoff/dataset/2852/documentation