Printed wiring board mounting facility - surface mounting line (printed wiring board mounting facility construction)
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Emission factor summary
The activity generating the emissions is printed wiring board mounting facility construction, surface mounting line. The Reference Product is printed wiring board mounting facility, surface mounting line. This is an immobile infrastructure, representing the construction of a printed wiring board mounting facility, surface mounting line. The facility is an example of a SMT mounting line that includes 3 small component placing machines, 2 big components placing machines, 1 inspection device and 1 reflow oven with a total mass of 19,300 kg. The process includes material, production efforts (material treatment processes) and infrastructure for the production of all the machineries used. The Reference Product amount is 1. The cut-off classification is allocatable product. The activity type is ordinary transforming activity. Please refer to the ecoinvent documentation for full details: https://ecoquery.ecoinvent.org/3.12/cutoff/dataset/4193/documentation
| Property | Value |
|---|---|
| Name | Printed wiring board mounting facility - surface mounting line (printed wiring board mounting facility construction) |
| Sector | Buildings and Infrastructure |
| Category | Construction |
| Source | ecoinvent |
| Source Dataset | Cut-off Cumulative LCIA v3.12 |
| Region | |
Unit Type | |
| Year | 2005 |
| Year Released | 2025 |
| Emission Factor |
|
| Scopes | 3.1, 3.2 |
LCA Activity | source_specific |
Supported CO2e Calculation Method | AR5, AR6 |
| Data Versioning |
|
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